mSAP (or modified semi-additive process) is a manufacturing process to build Printed Circuit Boards with ultra-fine features.

Due to the continuous demand for the miniaturization of electronic components, the need for mSAP technology is growing rapidly in North America.

Typically, we see trace widths and spacings that are 25 micron (.001") and below. This type of technology is being driven by the Chip-packaging, Smartphone and micro-electronic sectors.

Advanced Copper Foil supplies the ultra-thin copper foils that are used in the mSAP process.