Ultrathin and very smooth carrier supported copper foil design for MSAP process (L/S of ~25/25 µm).

Typical Substrate

Bismaleimide-Triazine (BT) and halogen-free high Tg epoxy resin systems.

Typical Process

MSAP process (using copper build-up followed by differential "flash etching" and CO2 laser direct ablation for via holes) used in IC Substrates and HDI/SLP ("Substrate Like PCB"). Also convenient for substractive process.

Typical Application

Mobile communication devices (like smartphones and tablets) and laptops.

Typical Average Properties