| Product | Description | Application | Roughness (Rz) |
|---|---|---|---|
| TZA | Low Profile, Zinc and Arsenic Free | Halogen-free and Phenolic Cured Resin Systems | 4 - 6 µm |
| TWLS | Low Loss Foil with Zinc, HTE Grade 3 | High Speed, Low Loss Multilayer and RF, Microwave Designs | 5 - 7.5 µm |
| BF-TZA | Ultra Low Loss Foil, Zinc and Arsenic Free | High Speed, Low Loss Multilayer and RF, Microwave Designs | ≤ 2.5 µm |
| BF-NN BF-NN-HT |
Super Flat Profile Copper Foil for Reduced Signal Losses | Ultra Low Loss Substrates including PPE, PPO & PTFE | ≤ 1.1 µm |
| BF-ANP | Almost No Profile | Our Flattest Copper Foils with Highest Data Transfer | ≤ 1.3 µm |
| BF-HFI-LP2 | HVLP, Zinc Free | Inner Layer CCL Foil, Low Signal Loss, High Speed Digital | ≤ 2.5 µm |
| DTH-NF DTH-ANP |
Ultrathin/Very Smooth Carrier Supported Copper Foil for Fine Line Spacing | Low Loss Substrates (PPE/PPO), BT and Halogen-free High Tg Epoxy Resin Systems | ≤ 0.9 µm ≤ 1.2 µm |
| DTH-N-TZA | Ultrathin Carrier Supported Copper Foil for Fine Line Spacing | Bismaleimide-Triazine (BT) and Halogen-free High Tg Epoxy Resin Systems | ≤ 1.8 µm |
| TZA-B | Low Profile, Zinc and Arsenic Free | Superior Oxidation Resistance for Halogen-free Resin Systems | ≤4.2 µm |
| BF-TZA-FX | Flex Copper Foil, Low Profile, Zinc and Arsenic Free | Flexible Circuits | ≤2.5 µm |
| TZA-FX | Flex Copper Foil, Very Low Profile, Zinc and Arsenic Free | Flexible Circuits | 4.1 - 6.7 µm |
| ACF2 ACF3 |
Aluminum-bonded Copper Foil | Printed Circuit Board | - |
| ACF Steel | Steel-bonded Copper Foil | Printed Circuit Board | - |
| ACF Screen | Copper Foil with Poly Carrier | Printed Circuit Board | - |